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  surface mount ultrafast rectifier voltage - 50 to 1000 volts curr ent - 3.0 amperes features ? for surface mounted applications ? low profile package ? built-in strain relief ? easy pick and place ? ultrafast recovery times for high efficiency ? plastic package has underwriters laboratory flammability classification 94v-o ? glass passivated junction ? high temperature soldering: 260 o c /10 seconds at terminals high temperature soldering : 260 ? o c / 10 seconds at terminals ? pb free product at available : 99% sn above meet rohs environment substance directive request mechanical data ? case: jedec do-214ab molded plastic terminals: solder plated, solderable per mil-std-750, ? method 2026 ? polarity: indicated by cathode band ? standard packaging: 16mm tape (eia-481) weight: 0.007 ounce, 0.21 gram characteristics symbol maximum recurrent peak reverse v oltage v rrm 50 100 200 400 600 800 1000 v maximum rms voltage v rms 35 70 140 280 420 560 700 v maximum dc blocking voltage v dc 50 100 200 400 600 800 1000 v maximum average forward rectified current @tl =75 i (av) 3.0 a peak forward surge current 8.3ms single half sine- wave super imposed on rated load (jedec method) i fsm 100 a maxi mum f orward voltage at 1.0a dc v f 1.0 1.3 1.5 1.7 v maxi mum dc rever se cur rent @tj =25 at rated dc block ing voltage @tj =100 i r 10 100 ua maximum reverse recovery time (note 1) t rr 50 75 ns typi cal junction capacitance (note 2) c j 20 10 pf typical thermal resistance (note 3 ) r jl 30 oper ati ng temperature range t j -55 to +150 storage temperature range t stg -55 to +150 notes : 1.reverse recovery test conditions :if=0.5a,ir=1.0a,irr=0.25a. 2.measured at 1.0mhz and applied reverse voltage of 4.0v dc. 3.thermal resistance junction to lead. data sheet semiconductor http://www.yeashin.com 1 rev.02 20110725 c c c/w c c c uf3ab thru uf3mb uf3ab uf3bb UF3DB uf3gb uf3jb uf3kb uf3mb units .083(2.11) .075(1.91) .012(.305) .006(.152) .012(.31) .006(.15) .008(.203) .002(.051) .050(1.27) .030(0.76) smb/do-214aa unit:inch(mm) .155(3.94) .130(3.30) .185(4.70) .160(4.06) .096(2.44) .083 ( 2.13) .220(5.59) .200(5.08)
note:1.rise time = 7ns max. input impedance = 1 megohm. 22pf 2.rise time = 10ns max. source impedance = 50 ohms t rr +0.5a 0 -0.25 -1.0 set time 1cm base for 50 ns/cm 3.0 2.5 2.0 1.5 1.0 0.5 50 60 70 80 90 100 110 120 130 140 150 single phase half 60hz resistive or load p.c.b mounted 0.3150.315"(8.08.0mm) copper pad lead temperature, fig. 1-reverse recovery time characteristic and test circuit diagram fig. 2-maximum average forward current rating 100 10 1 0.1 0.01 0 20 40 60 80 100 120 140 t j = 150 t j = 100 t j = 25 percent of peak reverse voltage volts 100 10 1 0.1 0.01 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 uf3mb uf3gb uf3ab ~ UF3DB t j = 25 pulse width = 300 2% duty cycle instantaneous forward voltage volts fig. 3-typical reverse characteristics fig. 4-typical forward characteristics 200 100 50 10 1 5 10 50 100 8.3ms single half sine wave jedec method number of cycles at 60hz 160 140 120 100 80 60 40 20 .1 .5 1 2 5 10 20 50 100 200 500 1000 uf3ab ~ UF3DB uf3gb ~ uf3mb tj = 25 f = 1mhz vsi g = 50mv p - p reverse voltage volts fi g . 5-maximum non-repetitive peak forward surge current fi g . 6-typical junction capacitance instantaneous forward current amperes instantaneous reverse leakage current, microamperes peak forward surge current, amperes capacitance, pf average forward current, amperes http://www.yeashin.com 2 rev.02 20110725 c c c c c s c rating and characteristic curves uf3ab thru uf3mb


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